Informations complémentaires
| size | 2Kg, 10kg |
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Description Silicone Gel 3035: Ultimate High-Performance Thermal Management Engineered strictly for mission-critical, ultra-high-density applications, 3035 is a premium thermal interface material. It is heavily filled wi
Engineered strictly for mission-critical, ultra-high-density applications, 3035 is a premium thermal interface material. It is heavily filled with specialized ceramic thermal conductors to handle extreme wattages, preventing thermal throttling in high-stress, continuous-use environments.
Thermal Conductivity: $4.0\text{ W/m}\cdot\text{K}$ — Ultra-fast heat extraction to maximize the life cycle of cutting-edge, high-frequency processors.
Viscosity & Flow: High-density paste requiring slightly higher dispensing pressure, yet formulated to achieve a very low Bond Line Thickness (BLT) for direct component contact.
Hardness: Shore 00 ~75. Despite its heavy ceramic filler loading, it remains elastic and will not crack, oil-bleed, or dry out under extreme thermal cycles.
Enterprise Computing: Cloud data center servers, high-speed networking switches, and enterprise-grade routers.
Telecom Infrastructure: 5G base stations, remote radio heads (RRH), and outdoor transceiver enclosures.
Advanced Automotive: Autonomous driving computer stacks (ADAS modules), electric vehicle (EV) battery management systems, and high-voltage inverters.
| size | 2Kg, 10kg |
|---|
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