Platinum cured silicone rubber R25

Silicone 3025: The Mid-Tier Standard Balanced Solution

When standard cooling isn’t enough but high-tier compounds exceed your budget, 3025 is the ideal choice. It offers a substantial leap in thermal performance while retaining excellent slump resistance, ensuring the gel stays precisely where it is dispensed during vertical or automated assembly.

Technical Performance Profile

• Thermal Conductivity: $2.5\text{ to }3.0\text{ W/m}\cdot\text{K}$ — Drastically reduces component junction temperatures compared to standard entry-level gels.

• Viscosity & Flow: Engineered with optimized thixotropic properties (it thins when pumped through a nozzle but instantly thickens once applied). It features excellent vertical stability.

• Hardness: Shore 00 ~74. Offers a highly compliant cushion that accommodates uneven multi-component heights on a single board layout.

Target Applications

• Automotive Electronics: Engine control units (ECUs), sensor clusters, and mid-range powertrain electronics.

• Industrial Automation: Variable frequency drives (VFDs), motor controllers, and robotic control modules.

• Microprocessors: Dense, multi-chip modules and mid-tier digital signal processing (DSP) boards.